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IC Package Engineer Resume

IC package engineer or an integrated circuit package engineer is an electronics engineer who performs packaging of semiconductor and analog devices. The job responsibilities of an integrated circuit package engineer include developing package designs, electrical design and fabrication, analyzing circuit boards and electrical chips, debugging electrical issues, investigating the manufacturing issues, characterizing signal and power integrity, analyzing the system levels, evaluating memory sub-systems, circuit stimulation and modeling, and so on. The job demands a bachelor's degree in engineering with specialization in electronics. It is mandatory to possess excellent troubleshooting and communication skills.

Sample IC Package Engineer Resume

Solomon Brown
667 Washburn Rd, Baton Rouge, Los Angles 70802
Cell: (222)-887-0027

Career Objective:

Seeking a position as an integrated circuit package engineer that offers an opportunity towards professional growth and development in a renowned organization

Knowledge & Skill Sets:

  • Comprehensive knowledge of electromagnetic radiation theory, design, and development of integrated circuit packaging
  • Extensive knowledge of package design tools, high-speed digital design, and manufacturing process
  • In-depth knowledge of circuit design, package component, electrical modeling, and Signal and Power Integrity
  • Familiar with Wire bond packaging, electrical and thermal concepts, and thermo-mechanical modeling
  • Sound knowledge of Solid Modeling Software, 2D and 3D EM simulation, and package design flow methodologies
  • Possess excellent troubleshooting, communication, and problem solving skills

Job Experience:

Organization: Engineering Solutions, Los Angles
Duration: April 2011 till date
Designation: IC Package Engineer

  • Handle the tasks of designing broad range of integrated circuit packages and lead frame packages
  • Assigned the responsibilities of handling package designs for oscillators and high speed digital analogue
  • Perform the tasks of designing packages for advanced crystal filter ceramic as well as provide solutions for integrated circuit packages
  • Handle the responsibilities of designing analog and power management package and develop plans to increase cost effectiveness
  • Assigned the tasks of conducting risk assessments and performed investigations on manufacturing issues
  • Responsible for co-ordinating with the design team in handling complex lead frame packages issues
  • Perform the responsibilities of analyzing the feasibility and package signal/Power integrity to meet the production standards

Organization: GTD Software, Los Angles
Duration: May 2009 to March 2010
Designation: Junior IC Package Engineer

  • Assigned the responsibilities of conducting research on packaging technology and prepared the technical designs and drawings
  • Handled the tasks of documenting technical guidelines and specifications under the instructions of senior engineers
  • Performed the responsibilities of handling new package validation and handling package design and quality issues
  • Assigned the tasks of defining package assembly process flow, logic/circuit design, and developing IC circuit boards
  • Responsible for co-ordinating with the production staff in handling packaging and production issues
  • Performed the responsibilities of handling quality assurance testing to ensure that it meets customer satisfaction
  • Handled the tasks of maintaining design guidelines for future reference

Educational Summary:

Achieved Bachelor's degree in Engineering
College of Engineering, Los Angles in the year 2009


Will be pleased to provide upon request

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